Sputter deposited Ni-Ti thin films on polyimide substrate

Journal article (2013)

Authors

V.G. Kotnur Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering
G.C.A.M. Janssen Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering
Research Group
Micro and Nano Engineering (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2013

Language

English

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Micro and Nano Engineering

Abstract

In this paper, we report on the feasibility of depositing Ni-Ti, with Ni-rich composition, thin films at 450 degrees C on polyimide. The films were magnetron co-sputter deposited from Ni-Ti and Ti targets on to three different substrate types: a) polyimide (PI) foils, b) SiO2/Si and c) PI spin coated Si wafers. The crystal structure, surface morphology and microstructure were studied using X-ray diffraction, atomic force microscopy and transmission electron microscopy. A difference in thin film growth mode was observed depending on the substrate. Ni-Ti films deposited on polyimide foil did not show any phase transformation upon thermal cycling. Ni-Ti films deposited on polyimide spin coated wafers showed the expected phase transformation upon thermal cycling. (c) 2013 Elsevier B.V. All rights reserved.