- Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
- Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
- Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation
- Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
- A Q-learning based multi-strategy integrated artificial bee colony algorithm with application in unmanned vehicle path planning
- Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
- Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study
- High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling
- Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
- Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
- Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
- High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
- Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation