Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Bio-safe drinking water with or without chlorine: a review

Critical turbidity thresholds for maintenance of estuarine tidal flats worldwide

Maximizing eco-environmental gains: Exploring underground wastewater treatment plants in Beijing for sustainable urban water management

Creation of memory–memory entanglement in a metropolitan quantum network

Performance evaluation of ventilative cooling systems for buildings under different control parameters and strategies

Air infiltration and related building energy consumption: A case study of office buildings in Changsha, China

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

Image restoration algorithm for terahertz FMCW radar imaging

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Spatial Resolution Matching of Microwave Radiometer Measurements Using Iterative Deconvolution with Close Loop Priors (ICLP)

Late-stage diversion risk assessment for high dams considering early initial impoundment: a case study of Lianghekou Station, China

A Series of Ternary Metal Chloride Superionic Conductors for High-Performance All-Solid-State Lithium Batteries

A Contribution to the Development of High-Voltage dc Circuit Breaker Technologies: A Review of New Considerations

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Improve the long-term property of heat-cured mortars blended with fly ash by internal curing