Print Email Facebook Twitter Temperature effects on the behaviour of liquid-laminated embedded glass connections Title Temperature effects on the behaviour of liquid-laminated embedded glass connections Author Volakos, Efstratios (University of Cambridge) Davis, Chris (H.B. Fuller, Kömmerling) Teich, Martien (seele GmbH) Lenk, Peter (Arup) Overend, M. (TU Delft Structural Design & Mechanics) Date 2023 Abstract Embedded load-bearing laminated glass connections have gained popularity in recent years due to their mechanical performance and aesthetic appeal. However, there is a paucity of data on their structural behaviour across a range of temperatures that may arise in building applications and there is also no simplified mechanics-based model for predicting their load–displacement response. This study addresses these gaps directly through experimental pull-out tests on steel inserts encapsulated in resin-laminated glass performed at various temperatures. The experimental results confirm that the response of the resin interlayer is time / temperature-dependent which therefore significantly affects the connection behaviour. In particular, both the stiffness and strength of the connection decrease with increasing temperature. Similarly, temperature also governs the failure mechanism of the connection. Specifically, temperatures at or below ambient indoor temperature (-10 °C and + 22 ± 2 °C) result in glass fracture whereas at + 50 °C the connection fails due to insert delamination. The numerical (FE) simulations of these tests show that a complex stress/strain state is set up in the vicinity of the embedded insert which correlates well with the experimentally observed failure mechanisms at different working temperatures. Finally, the insights gained along with the data generated from the experimental and numerical work were used to develop a simple analytical tool that predicts the pull-out load–displacement response of the embedded connection at different temperatures and load durations. Subject Analytical modelExperimental TestsLiquid-laminated embedded connectionsNumerical (FE) simulationsTemperature To reference this document use: http://resolver.tudelft.nl/uuid:cda3705d-0e11-4c83-9271-f6bf013e3111 DOI https://doi.org/10.1016/j.engstruct.2022.115164 ISSN 0141-0296 Source Engineering Structures, 274 Part of collection Institutional Repository Document type journal article Rights © 2023 Efstratios Volakos, Chris Davis, Martien Teich, Peter Lenk, M. Overend Files PDF 1_s2.0_S0141029622012408_main.pdf 12.45 MB Close viewer /islandora/object/uuid%3Acda3705d-0e11-4c83-9271-f6bf013e3111/datastream/OBJ/view