A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink

A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink

Guo, P. (TU Delft Bio-Electronics)
Chang, Z.Y. (TU Delft Electronic Instrumentation)
Noothout, E.C. (TU Delft ImPhys/Verweij group)
Vos, H.J. (TU Delft ImPhys/Verweij group; Erasmus MC)
Bosch, J. G. (Erasmus MC)
de Jong, N. (TU Delft ImPhys/De Jong group; Erasmus MC)
Verweij, M.D. (TU Delft ImPhys/Medical Imaging; TU Delft ImPhys/Verweij group; Erasmus MC)
Pertijs, M.A.P. (TU Delft Electronic Instrumentation)

2023

This paper presents a pitch-matched transceiver ASIC integrated with a 2-D transducer array for a wearable ultrasound device for transfontanelle ultrasonography. The ASIC combines 8-fold multiplexing, 4-channel micro-beamforming (μ BF) and sub-array-level digitization to achieve a 128-fold channel-count reduction. The μ BF is based on passive boxcar integration and interfaces with a 10-bit 40 MS/s SAR ADC in the charge domain, thus obviating the need for explicit anti-alias filtering and power-hungry ADC drivers. A compact and low-power reference generator employs an area-efficient MOS capacitor as a reservoir to quickly set a reference for the ADC in the charge domain. A low-power multi-level data link concatenates outputs of four ADCs, leading to an aggregate 3.84 Gb/s data rate. Per channel, the RX circuit consumes 2.06 mW and occupies 0.05 mm2.

http://resolver.tudelft.nl/uuid:251fdc1c-ae77-4c95-86b1-f73b8332da9b

https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185159

Institute of Electrical and Electronics Engineers (IEEE)

2024-01-29

9784863488069

2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023

2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023, 2023-06-11 → 2023-06-16, Kyoto, Japan

Digest of Technical Papers - Symposium on VLSI Technology, 0743-1562, 2023-June

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Institutional Repository

conference paper

© 2023 P. Guo, Z.Y. Chang, E.C. Noothout, H.J. Vos, J. G. Bosch, N. de Jong, M.D. Verweij, M.A.P. Pertijs