Novel Method for Adhesion between PI-PDMS Using Butyl Rubber for Large Area Flexible Body Patches

Conference paper (2017)

Authors

S. Joshi Philips Research, Electronic Components, Technology and Materials - EEMCS
R. Bagani External organisation
Lucas Beckers Philips Research
R. Dekker Philips Research, Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2017 S. Joshi, R. Bagani, Lucas Beckers, R. Dekker
DOI: https://doi.org/10.3390/proceedings1040307
More Info
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Published Date

2017

Language

English

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

This paper reports the use of rubber—Polybutadiene as an intermediate adhesive layer for improving the adhesion between polyimide (PI) and silicone polydimethylsiloxane (PDMS) which is required for a reliable fabrication of flexible/stretchable body patches for various applications. The adhesive bond initiated by the butyl rubber (BR), apart from being extremely strong, is also chemically resistant and mechanically stable as compared to the state of the art processes of improving adhesion between PI and Silicone.