Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

Journal article (2003)
Copyright: © 2003 Yang, D.G.; Zhang, G.Q.; Ernst, L.J.; Hof, Cv.; Caers, J.F.J.M.; Bressers, H.J.L.; Janssen, J.H.J.
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Published Date

2003

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Source:

IEEE Transactions on Components and Packaging Technologies, 26 (2) [see also IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies]

ISSN:

1521-3331