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L.J. Ernst
Authored
1 records found
Investigation on flip chip solder joint fatigue with cure-dependent underfill properties
Journal article -
D.G. Yang
,
G.Q. Zhang
,
L.J. Ernst
,
C. van 't Hof
,
J.F.J.M. Caers
,
H.J.L. Bressers
,
J.H.J. Janssen