Print Email Facebook Twitter Electrodeposited Sn-Cu-Ni alloys as lead-free solders on copper substrate using deep eutectic solvents Title Electrodeposited Sn-Cu-Ni alloys as lead-free solders on copper substrate using deep eutectic solvents: The influence of electrodeposition mode on the morphology, composition and corrosion behaviour Author State, Sabrina Patricia (Politehnica University of Bucharest) Costovici, Stefania (Politehnica University of Bucharest) Mousavi, M. (TU Delft Team Yaiza Gonzalez Garcia) Gonzalez Garcia, Y. (TU Delft Team Yaiza Gonzalez Garcia) Zanella, Caterina (Jönköping University) Cojocaru, Anca (Politehnica University of Bucharest) Anicai, Liana (Politehnica University of Bucharest) Visan, Teodor (Politehnica University of Bucharest) Enachescu, Marius (Politehnica University of Bucharest) Date 2024 Abstract In this work we present the pulsed current (PC) electrodeposition of Sn-Cu-Ni alloy as lead-free solder candidate, from choline chloride – ethylene glycol eutectic mixtures (1:2 molar ratio) onto copper metallic substrates. Electrolytes containing Sn2+, Cu2+ and Ni2+ salts in the selected deep eutectic solvent have been considered. The effect of the applied frequency of PC on the morphology, composition and melting point of the alloy is discussed and compared to the ones obtained using direct current (DC) plating mode. A refinement of the grain size and lower melting temperature of the alloy were noticed when pulsed current was applied. A comparative analysis of the electrochemical corrosion behaviour at macro- and micro- scale has been performed in 0.5 M and 0.1 M NaCl solutions involving potentiodynamic polarization curves, electrochemical impedance spectroscopy (EIS) and scanning vibrating electrode (SVET) techniques. Furthermore, an analysis after 96 h of exposure to salt mist test simulating a corrosive attack in harsh environment is presented, too. The obtained results showed enhanced corrosion resistance of the ternary alloys electrodeposited under PC conditions (the best for 1.67 Hz frequency) as compared to those using DC. Additionally, Raman spectroscopy evidenced the presence of tin oxi/hydroxy chloride and tin oxides as surface corrosion products. A corrosion mechanism has been proposed. Subject Corrosion behaviourDeep eutectic solventsElectrodepositionSn-Cu-Ni ternary alloySVET To reference this document use: http://resolver.tudelft.nl/uuid:a0726188-1df7-4115-a43f-84d87d6167aa DOI https://doi.org/10.1016/j.surfcoat.2023.130324 Embargo date 2024-06-21 ISSN 0257-8972 Source Surface and Coatings Technology, 477 Bibliographical note Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Part of collection Institutional Repository Document type journal article Rights © 2024 Sabrina Patricia State, Stefania Costovici, M. Mousavi, Y. Gonzalez Garcia, Caterina Zanella, Anca Cojocaru, Liana Anicai, Teodor Visan, Marius Enachescu Files file embargo until 2024-06-21