Monolithic 3D Wafer Level Integration

Applied for Smart LED Wafer Level Packaging

Doctoral thesis (2017)

Authors

Z. Koladouz Esfahani Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

DOI: https://doi.org/10.4233/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca

LED System-in-Package 3D wafer-level integration High aspect ratio lithography Multi-step imaging Smart silicon interposer Side-wall photodiode Blue/UV selective photodetector Sensor readout BiCMOS process Wafer-level optic Multidisciplinary simulation Optical simulation

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http://resolver.tudelft.nl/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca

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Published Date

2017

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Files

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