Monolithic 3D Wafer Level Integration

Applied for Smart LED Wafer Level Packaging

Doctoral thesis (2017)

Authors

Z. Koladouz Esfahani Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2017 Z. Koladouz Esfahani
DOI: https://doi.org/10.4233/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca
LED System-in-Package 3D wafer-level integration High aspect ratio lithography Multi-step imaging Smart silicon interposer Side-wall photodiode Blue/UV selective photodetector Sensor readout BiCMOS process Wafer-level optic Multidisciplinary simulation Optical simulation
More Info
expand_more

Published Date

2017

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials