Passive Cooling of mm-Wave Active Integrated 5G Base Station Antennas Using CPU Heatsinks

Conference paper (2019)

Authors

Y. Aslan Microwave Sensing, Signals & Systems - EEMCS
Antonius Johannes Biggelaar Eindhoven University of Technology
Ulf Johannsen Eindhoven University of Technology
Alexander Yarovoy Microwave Sensing, Signals & Systems - EEMCS
Research Group
Microwave Sensing, Signals & Systems (EEMCS) (TU Delft)
Copyright: © 2019 Y. Aslan, Caner Ekin Kiper, Antonius Johannes Biggelaar, Ulf Johannsen, Alexander Yarovoy
Passive cooling Active integrated antenna Base station antenna CPU cooler Fifth-generation (5G) Millimeter-wave communication
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Published Date

2019

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Microwave Sensing, Signals & Systems

Abstract

The challenge of cooling in mm-wave chipintegrated base station antenna arrays is addressed. Several approaches in thermal modeling of electronics are revisited and discussed. The two-resistor compact thermal model is applied to predict the junction temperatures of the beamformer chips. Thermal simulations are performed for two fabricated arrays having 16 chips (single-polarized) and 32 chips (dual-polarized). Two commercial passive CPU heatsinks with different capabilities are modeled and attached to the chips. The simulation results are validated through experiments using the temperature sensor readings. The reasons of discrepancies between the simulated and measured results are explained.