Print Email Facebook Twitter A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink Title A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink Author Guo, P. (TU Delft Bio-Electronics) Chang, Z.Y. (TU Delft Electronic Instrumentation) Noothout, E.C. (TU Delft ImPhys/Verweij group) Vos, H.J. (TU Delft ImPhys/Verweij group; Erasmus MC) Bosch, J. G. (Erasmus MC) de Jong, N. (TU Delft ImPhys/De Jong group; Erasmus MC) Verweij, M.D. (TU Delft ImPhys/Medical Imaging; TU Delft ImPhys/Verweij group; Erasmus MC) Pertijs, M.A.P. (TU Delft Electronic Instrumentation) Date 2023 Abstract This paper presents a pitch-matched transceiver ASIC integrated with a 2-D transducer array for a wearable ultrasound device for transfontanelle ultrasonography. The ASIC combines 8-fold multiplexing, 4-channel micro-beamforming (μ BF) and sub-array-level digitization to achieve a 128-fold channel-count reduction. The μ BF is based on passive boxcar integration and interfaces with a 10-bit 40 MS/s SAR ADC in the charge domain, thus obviating the need for explicit anti-alias filtering and power-hungry ADC drivers. A compact and low-power reference generator employs an area-efficient MOS capacitor as a reservoir to quickly set a reference for the ADC in the charge domain. A low-power multi-level data link concatenates outputs of four ADCs, leading to an aggregate 3.84 Gb/s data rate. Per channel, the RX circuit consumes 2.06 mW and occupies 0.05 mm2. To reference this document use: http://resolver.tudelft.nl/uuid:251fdc1c-ae77-4c95-86b1-f73b8332da9b DOI https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185159 Publisher IEEE Embargo date 2024-01-29 ISBN 9784863488069 Source 2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023 Event 2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023, 2023-06-11 → 2023-06-16, Kyoto, Japan Series Digest of Technical Papers - Symposium on VLSI Technology, 0743-1562, 2023-June Bibliographical note Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Part of collection Institutional Repository Document type conference paper Rights © 2023 P. Guo, Z.Y. Chang, E.C. Noothout, H.J. Vos, J. G. Bosch, N. de Jong, M.D. Verweij, M.A.P. Pertijs Files PDF A_Pitch_Matched_Transceiv ... talink.pdf 2.27 MB Close viewer /islandora/object/uuid:251fdc1c-ae77-4c95-86b1-f73b8332da9b/datastream/OBJ/view