Title
A 1.2mW/channel 100m-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging
Author
Guo, P. (TU Delft Electronic Instrumentation)
Fool, F. (TU Delft ImPhys/Medical Imaging)
Noothout, E.C. (TU Delft ImPhys/Medical Imaging)
Chang, Z.Y. (TU Delft Electronic Instrumentation)
Vos, H.J. (TU Delft ImPhys/Medical Imaging; Erasmus MC)
Bosch, Johan G. (Erasmus MC)
Verweij, M.D. (TU Delft ImPhys/Medical Imaging; Erasmus MC)
de Jong, N. (TU Delft ImPhys/Medical Imaging; Erasmus MC)
Pertijs, M.A.P. (TU Delft Electronic Instrumentation)
Contributor
Fujino, Laura C. (editor)
Date
2022
Abstract
The integration of 2D ultrasonic transducer arrays and pitch-matched ASICs has enabled the realization of various 3D ultrasound imaging devices in recent years [1]-[3]. As applications such as 3D intravascular ultrasonography, intra-cardiac echocardiography, and trans-fontanelle ultrasonography call for miniaturization and improved spatial resolution, higher-frequency transducers (>5MHz) with a correspondingly smaller array pitch (<150m) are needed. Such devices generally employ a large number of transducer elements, calling for channel-count reduction in the ASIC while meeting stringent restrictions on per-element power consumption and die area. Micro-beamforming (BF) is an effective way of reducing channel count by performing a delay-and-sum operation on the echo signals received within a sub-array [1]. However, prior BF implementations employ per-element capacitive memory to realize the delay [1], [2], making it increasingly difficult to apply BF in smaller-pitch arrays.
To reference this document use:
http://resolver.tudelft.nl/uuid:793197b3-666a-4f43-b031-0beff49f32a6
DOI
https://doi.org/10.1109/ISSCC42614.2022.9731784
Publisher
IEEE, Danvers
Embargo date
2023-07-01
ISBN
978-1-6654-2801-9
Source
2022 IEEE International Solid-State Circuits Conference, ISSCC 2022: Digest of technical papers
Event
2022 IEEE International Solid- State Circuits Conference (ISSCC), 2022-02-20 → 2022-02-26, Online at San Francisco, United States
Series
Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 0193-6530, 2022-February
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2022 P. Guo, F. Fool, E.C. Noothout, Z.Y. Chang, H.J. Vos, Johan G. Bosch, M.D. Verweij, N. de Jong, M.A.P. Pertijs