Self-encapsulation of epoxy resin by a controlled interface curing process in epoxy/water emulsion

Conference paper (2013)
Copyright: © 2013 Zhu, G.; Zhou, Y.; Wu, Z.; Tang, J.; Dong, B.; Han, N.; Xing, F.
More Info
expand_more

Published Date

16-06-2013

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Abstract

The microcapsules of epoxy E-51 resin encapsulated by cured itself were prepared by interfacial curing reaction, in which ethylenediamine (EDA) was employed as curing agent and sulfonated copolymer of styrene and maleic anhydride (SMA) as emulsifying agent. It’s found the morphology of microcapsules strongly depend on reaction time and EDA dosage. Usually, the microcapsules were formed in 20mins, Extension of the time doesn’t change the morphology but thicken the shell and strengthen the microcapsules. Large dose of EDA bring about smooth surface of microcapsules. It’s believed that this simple process to fabricate epoxy microcapsules is more suitable for the application of self healing concrete, because it is ease to be industrialized and can be produced in large scale.

Files

Zhu.pdf
(pdf | 0.656 Mb)