Title
AI-assisted Design for Reliability: Review and Perspectives
Author
Yuan, Cadmus (Feng Chia University)
de Jong, S.D.M. (TU Delft Electronic Components, Technology and Materials)
van Driel, W.D. (TU Delft Electronic Components, Technology and Materials) 
Date
2024
Abstract
The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this backdrop, machine learning technologies emerge as dynamic tools for correlation building and classification, revolutionizing the traditional approaches to design, manufacturing, and testing in electronic packaging, as well as the Design for Reliability (DfR) methodologies.This paper reviews the most recent AI-assisted approach for electronic packaging and then focuses on the AI-assisted DfR (AI-DfR) approaches. Our examination reveals that AI methods have been adapted to meet the specific needs of electronic packaging. The industry’s anticipation for AI-DfR stems from its potential to address prevailing reliability design challenges, yet its multidisciplinary essence poses hurdles to swift progress. This review proposes future directions for AI-DfR’s development, spotlighting critical areas such as the quality and efficiency of finite element modeling, design and optimization of training models, selection of AI models, and maintenance and value enhancement strategies.
Subject
Electronic Packaging: Design
AI model
Testing and Reliability
Design for reliability
To reference this document use:
http://resolver.tudelft.nl/uuid:cd266b93-04d7-43ad-bc43-8af2e61a9844
DOI
https://doi.org/10.1109/EuroSimE60745.2024.10491447
Publisher
IEEE
Embargo date
2024-10-09
ISBN
979-8-3503-9364-4
Source
Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024-04-07 → 2024-04-10, Catania, Italy
Series
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2024 Cadmus Yuan, S.D.M. de Jong, W.D. van Driel