Print Email Facebook Twitter A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques Title A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques Author Feng, Xiangdong (Zhejiang University; Nanhu Brain-Computer Interface Institute) Luo, Yuxuan (Zhejiang University) Cai, Tianyi (Zhejiang University) Xuan, Yangfan (Zhejiang University) Zhang, Yunshan (Microaiot) Shen, Yili (Zhejiang University) Yang, Changgui (Zhejiang University) Xiao, Qijing (Zhejiang University) Du, S. (TU Delft Electronic Instrumentation) Zhao, Bo (Zhejiang University; Nanhu Brain-Computer Interface Institute) Date 2024 Abstract The growing trend of the Internet of Things (IoT) involves trillions of sensors in various applications. An extensive array of parameters need to be gathered concurrently with high-precision, low-cost, and low-power sensor nodes, such as resistive (R) and capacitive (C) sensors. Single-chip channel fusion can be an effective solution, while it is challenging to suppress the noise and integrate massive I/O pads. However, conventional oversampling noise-shaping methods increase power consumption, which fails to meet the demand of long-term monitoring applications. In addition, existing R/C sensor-interface chips require a pair of I/O pads for each sensor, where the pad frame dominates the overall chip area in massive-channel integration. In this work, we demonstrate a 72-channel R&C sensor-interface chip for proximity-and-temperature sensing. A noise-orthogonalizing technique is proposed to eliminate the quantization noise at the signal frequencies, achieving an energy efficiency of 19.1 pJ/step/channel. Moreover, a pad-sharing technique is proposed to reduce the number of I/O pads by half, enabling 72 sensors to be read by 36 pairs of I/O pads. The chip is fabricated by 65-nm CMOS technology, and measurement results show resolutions of 286 Omega and 162 fF, respectively. The power consumption and die area are reduced to 0.74 mu text{W} /Channel and 0.038 mm2/Channel, respectively. Subject Low powermultichannel sensingnoise-orthogonalizingpad-sharingsensor interface To reference this document use: http://resolver.tudelft.nl/uuid:d3cdc49f-3d2c-4b85-b8f4-0f63af6193d8 DOI https://doi.org/10.1109/JSSC.2023.3344587 Embargo date 2024-07-23 ISSN 1558-173X Source IEEE Journal of Solid State Circuits, 59 (3), 702-715 Part of collection Institutional Repository Document type journal article Rights © 2024 Xiangdong Feng, Yuxuan Luo, Tianyi Cai, Yangfan Xuan, Yunshan Zhang, Yili Shen, Changgui Yang, Qijing Xiao, S. Du, Bo Zhao Files file embargo until 2024-07-23