Single-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon

This paper presents a new method for the CMOS compatible fabrication of microchannels integrated into a silicon substrate. In a single-step DRIE process (Deep Reactive Ion Etching) a network of microchannels with High Aspect Ratio (HAR) up to 10, can be etched in a silicon substrate through a mesh mask. In the same single etching step,...

Miniaturized Optical Data Link Assembly for 360 um Guidewires

We propose a novel concept for a high-speed optical data link in Ø 360 µm cardiovascular interventional imaging guidewires. The concept is based on the recently introduced Flex-to-Rigid (F2R) technology platform. This technology allows for smaller intravascular imaging devices with a more compact form-factor. We extended the existing F2R...