Low-Cost and Low-Temperature Integration Methods for System-in-Package

Packaging has evoluted for years with the sole purpose of protecting the electronics from the environment and providing a suitable operating environment. Integration became a necessity and technologies as System-in-Package emerged and enabled the integration of components built with different technologies within a single package. All this...

Low-Cost Technology for the Integration of Micro- and Nanochips into Fluidic Systems on Printed Circuit Board: Fabrication Challenges

Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film...