Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...

Warpage analysis on power module ceramic substrates

This study deals with the challenge of warpage in power modules, vital components in the rapidly expanding electric and hybrid-electric vehicle industry. The variations in temperature during manufacturing, resulting in significant warpage changes, contribute to device cracks, delamination, and reduced reliability.<br/>The primary focus is...

Seismic and stability analysis of component-based extraterrestrial vaults

For the first time since the 1970s, concrete plans are in motion to bring humans back to the Moon through the Artemis programme. The dawning era of space exploration aims to set the groundwork for long-term off-Earth settlement, with sights on bringing the first humans to Mars. In order to provide a safe means of inhabiting extraterrestrial (ET)...

Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...

Evaluation of low-cost oxygen carriers for biomass chemical looping gasification

Biomass Chemical Looping Gasification (BCLG) is a cost-effective and efficient alternative to conventional gasification. The selection of appropriate oxygen carriers (OCs) is crucial for stable BCLG performance. These OCs need to possess high reactivity, selectivity, material strength, and resistance to sintering. The study investigated...

Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application

Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...

Sintering mechanism of Ag nanoparticle-nanoflake: a molecular dynamics simulation

This paper studied the behaviors of sintering between Ag nanoparticle (NP) and nanoflake (NF) in the same size by molecular dynamics simulation. Before the sintering simulation, the melting simulation of NF was carried out to calculate the melting points of NFs and investigate the thermostability of NF. The Lindemann index and potential...

Influence of Sintering Temperature on the Structural, Morphological, and Electrochemical Properties of NiO-YSZ Anode Synthesized by the Autocombustion Route

In this study, nickel oxide–Y2O3-doped ZrO2 (NiO-YSZ) composite powder as an anode material was synthesized using a cost-effective combustion method for high-temperature solid oxide fuel cell (SOFC). Further, the effects of sintering temperatures (1200, 1300, and 1400 °C) were studied for its properties in relation to the SOFC performance. The...

Static and dynamic stickiness tests to measure particle stickiness

Sticking of particles has a tremendous impact on powder-processing industries, especially for hygroscopic amorphous powders. A wide variety of experimental methods has been developed to measure at what combinations of temperature and moisture content material becomes sticky. This review describes, for each method, how so-called stickiness...

Solvent-cast 3D printing of magnesium scaffolds

Biodegradable porous magnesium (Mg) scaffolds are promising for application in the regeneration of critical-sized bone defects. Although additive manufacturing (AM) carries the promise of offering unique opportunities to fabricate porous Mg scaffolds, current attempts to apply the AM approach to fabricating Mg scaffolds have encountered some...

Stress analysis of pressure-assisted sintering for the double-side assembly of power module

Purpose: Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences and sintering pressures during the sintering processes. Design/methodology/approach: Three sintering sequences, S(a)...