Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Investigation on Transient Failure Mode of Asymmetric Trench Gate SiC MOSFET Under Single-Pulse Avalanche Stress

In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...

Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...

High-Voltage and High-Current IGBT Press-pack Module for Power Grid

On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid...

Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles: A molecular dynamics study

Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular...

Study on Reverse Recovery of a P-pillar Tunable Super-Junction MOSFET*

In this paper, a novel bubble-shift super junction (SJ) MOSFET structure is proposed, and its main static electrical parameters and reverse recovery characteristics are simulated by TCAD software tool. By designing the P-pillar ion implantation windows with a certain offset, the bubble-shift SJ-MOSFET contains a curved pillar region in the upper...

A TCAD Simulation Study on the Short-circuit Performance of 650V P-pillar Offset Super-junction MOSFET

The limitation of Silicon based power MOSFET was broken by the super-junction (SJ) structure, which can provide lower specific on-resistance and higher breakdown voltage compared with the conventional power MOSFET structure. Multi-epitaxial and multi-ion-implant technology, as a mature manufacturing process of the SJ structure, has been widely...

Research on Thermal-Mechanical Properties of GaN Power Module Based on QFN Package by Using Nano Copper/Silver Sinter Paste

The wide-bandgap semiconductors represented by GaN have a broad application prospect because of their high service temperature and high switch frequency. Quad-Flat-No-Lead (QFN) Package is currently one of the mainstream packaging methods due to its low cost and high efficiency. However, the low reliability of QFN used in GaN devices is still...

In situ observation of tricalcium aluminate dissolution in water

The nanoscale dissolution flux of tricalcium aluminate (C3A) in flowing water is characterized in situ by Digital Holographic Microscopy (DHM). The pure dissolution of C3A in flowing water with a flow rate of 34 ml·min-1 before the precipitation of hydrated phases only lasted about one quarter of a second, and the pure dissolution rate mostly...

Through-Screen Visible Light Sensing Empowered by Embedded Deep Learning

Motivated by the trend of realizing full screens on devices such as smartphones, in this work we propose through-screen sensing with visible light for the application of fingertip air-writing. The system can recognize handwritten digits with under-screen photodiodes as the receiver. The key idea is to recognize the weak light reflected by the...

Fabrication of Nanoslits with <111> Etching TSWE Method

In this paper, we report a modified three step anisotropic wet etching (TSWE) method to fabricate solid-state silicon nanoslits. The slit-opening process is performed by &lt;111&gt; crystal plane etching. The etching rate of the &lt;111&gt; crystal plane is reasonably slow as it is only 1/45 of the &lt;100&gt; etching rate, thus allowing and...

Design Considerations and Short-Circuit Characteristics of Fully Superconducting Wind Turbine Generators

Compared with partially superconducting generators, fully superconducting generators (F-SCGs) can further increase the torque density in large direct-drive wind turbine applications. Design trends of F-SCGs intend to increase the electrical loading by applying superconducting wires and boost the current density in the armature winding to meet...

Optimization of a geopolymer mixture for a reinforced cantilever concrete bench

Quantification the filling of microcracks due to Autogenous self-healing in cement paste

Microcracks play vital roles in the prediction of the service life of concrete structure. Because microcracks in concrete structure are the preferential ingression channels for aggressive ions, e.g., chloride, sulphate, etc. However, microcracks have potentials to self-heal autogenously due to the continuous hydration of unhydrated cement,...