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Yuan, S. (author), Zhang, Z. (author), Fieback, M. (author), Xun, H. (author), Marinissen, E. J. (author), Kar, G. S. (author), Rao, S. (author), Couet, S. (author), Taouil, M. (author), Hamdioui, S. (author)
The development of Spin-Transfer Torque Magnetic RAMs (STT-MRAMs) mass production requires high-quality test solutions. Accurate and appropriate fault modeling is crucial for the realization of such solutions. This paper targets fault modeling and test generation for all interconnect and contact defects in STT-MRAMs and shows that using the...
conference paper 2023
document
Xun, H. (author), Fieback, M. (author), Yuan, S. (author), Zhang, Ziwei (author), Taouil, M. (author), Hamdioui, S. (author)
Resistive Random Access Memory (RRAM) is a potential technology to replace conventional memories by providing low power consumption and high-density storage. As various manufacturing vendors make significant efforts to push it to high-volume production and commercialization, high-quality and efficient test solutions are of great importance. This...
conference paper 2023
document
Wang, S. (author), Tan, Yanlong (author), Liu, Xu (author), Li, Shizhen (author), Liu, Ke (author), Yuan, Wucheng (author), Li, Tao (author), Zhang, Kouchi (author), French, P.J. (author), Ye, Huaiyu (author), Tan, Chunjian (author)
In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...
conference paper 2023
document
Tian, J. (author), Yang, H. (author), Zhang, Z. (author), Yuan, G. (author), Rao, Z. (author), Hua, H. (author)
conference paper 2014
document
Rong, M.Z. (author), Zhang, M.Q. (author), Yuan, C.E. (author), Wang, F. (author)
Generally, intrinsic self-healing polymers based on reversible covalent bonds scission and reconnection would lose their load bearing capability as a result of molecular cleavage during healing process. This shortcoming also results in creep deformation of the products. To solve the problem, we introduce a novel healing mechanism by using...
conference paper 2013
document
Dawotola, A.W. (author), Yuan, C.A. (author), Van Driel, W.D. (author), Bakkers, E.P.A.M. (author), Zhang, G.Q. (author)
conference paper 2007
document
Yuan, C. (author), Van Der Sluis, O. (author), Zhang, G.Q. (author), Ernst, L.J. (author), Van Driel, W.D. (author), Van Silfhout, R.B.R. (author), Thijsse, B.J. (author)
conference paper 2007
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