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Chen, X. (author), Liu, X. (author), Qian, Z. (author), Lei, Z. (author)
Reliable and durable asphalt surfacing systems still remain to be desired for the long-spanned orthotropic steel bridges as the nationally and internationally reports on distresses in deck pavement. Based on ten-year research works, this paper has presented a brief review and discussion of the Chinese practices and experiences of deck pavement...
conference paper 2012
document
Fan, Jiajie (author), Qian, Yichen (author), Chen, Wei (author), Jiang, Jing (author), Tang, Zhuorui (author), Fan, Xuejun (author), Zhang, Kouchi (author)
A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...
conference paper 2022