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Rong, Jian (author), Zhu, Jia-Ning (author), Xiao, Wenlong (author), Zhao, Xinqing (author), Ma, Chaoli (author)
Thermal conductivity is a key parameter for high performance material needed for electronic devices. While most commercially used Mg foundry alloys exhibit low thermal conductivities. In this work, we developed an Mg–3RE–0.5Zn alloy that is suitable for high pressure die cast (HPDC) ultrathin wall cellphone components. The thermal...
journal article 2021
document
Ma, X. (author), Schlangen, E. (author), Copuroglu, Oguzhan (author)
The aim of this paper is to investigate the mechanical properties of cement paste specimens by both experimental and numerical methods. Firstly, the specimens subjected to uniaxial tensile loading were studied experimentally. Afterwards, numerical investigation was carried out based on the experimental observations. Two types of specimens...
journal article 2019