Finite Element Modeling for Thermal Conductivity of Cement-based Encapsulation Materials

With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...

A high pressure die cast magnesium alloy with superior thermal conductivity and high strength

Thermal conductivity is a key parameter for high performance material needed for electronic devices. While most commercially used Mg foundry alloys exhibit low thermal conductivities. In this work, we developed an Mg–3RE–0.5Zn alloy that is suitable for high pressure die cast (HPDC) ultrathin wall cellphone components. The thermal...