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Ding, Chao (author), Wang, Jian (author), Liu, Tianhan (author), Qin, Hongbo (author), Yang, Daoguo (author), Zhang, Kouchi (author)Full intermetallic compound (IMC) solder joints present fascinating advantages in high-temperature applications. In this study, the mechanical properties and elastic anisotropy of η’-Cu6Sn5 and Cu3Sn intermetallic compounds were investigated using first-principles calculations. The values of single-crystal elastic constants, the elastic (E),...journal article 2021