In Situ  Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

Recent advancements in automotive technologies, most notably autonomous driving, demand electronic systems much more complex than those realized in the past. The automotive industry has been forced to adopt advanced consumer electronics to satisfy the demand, and thus it becomes more challenging to assess system reliability while adopting the...

A new hermetic sealing method for ceramic package using nanosilver sintering technology

High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There...

Cracking potential of alkali-activated slag and fly ash concrete subjected to restrained autogenous shrinkage

This study aims to investigate the cracking potential of alkali-activated slag (AAS) and alkali-activated slag-fly ash (AASF) concrete subjected to restrained autogenous shrinkage. Temperature Stress Testing Machine (TSTM) is utilized, for the first time, to monitor the stress evolution and to measure the cracking time of alkali-activated...

Combined effects of stress and temperature on hydrogen diffusion in non-hydride forming alloys applied in gas turbines

Hydrogen plays a vital role in the utilisation of renewable energy, but ingress and diffusion of hydrogen in a gas turbine can induce hydrogen embrittlement on its metallic components. This paper aims to investigate the hydrogen transport in a non-hydride forming alloy such as Alloy 690 used in gas turbines inspired by service conditions of...

Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...