High-performance, Cost-effective 3D Stacked Wide-Operand Adders

Through-Silicon Vias (TSV) based 3D Stacked IC (3D-SIC) technology introduces new design opportunities for wide operand width addition units. Different from state of the art direct folding proposals we introduce two cost-effective 3D Stacked Hybrid Adders with identical tier structure, which potentially makes the manufacturing of hardware wide...