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Gao, Yu (author), Zhang, Jingru (author), Wang, Donglei (author), Fan, Jiaxin (author), Mol, J.M.C. (author), Wang, Fuhui (author), Zhang, Danni (author), Xu, Dake (author)
Microbially influenced corrosion (MIC) of metals exerts a negative effect on the marine environment and causes a great loss of marine facilities. Corrosion prevention in an eco-friendly and sustainable way is a difficult problem to address, especially in the marine environment. In this work, Nocardiopsis dassonville, a corrosive bacteria...
journal article 2024
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Wang, Hanyu (author), Chen, Dengkai (author), Huang, Y. (author), Zhang, Yahan (author), Qiao, Yidan (author), Xiao, Jianghao (author), Xie, Ning (author), Fan, Hao (author)
This study aimed to enhance the real-time performance and accuracy of vigilance assessment by developing a hidden Markov model (HMM). Electrocardiogram (ECG) signals were collected and processed to remove noise and baseline drift. A group of 20 volunteers participated in the study. Their heart rate variability (HRV) was measured to train...
journal article 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)
Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...
journal article 2023
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Qian, Cheng (author), Gu, Tijian (author), Wang, Ping (author), Cai, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Sintered nano-silver die-attach materials have been widely used in high-power electronics packaging because of their high thermal and electrical conductivities. In this study, we characterized the tensile properties of sintered nano-silver particles over a range of strain rates and temperatures, and established the constitutive models. First, 50...
journal article 2022
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Yang, Shangyu (author), Zhang, Renren (author), Wang, Jianjun (author), Li, Xinhong (author), Fan, Heng (author), Yang, M. (author)
Ultra-deep oil and gas wells have become a new development trend in onshore oil and gas exploitation. However, Ultra-deep oil and gas wellbore casing is with high failure risk due to the harsh environment. It is essential to evaluate the reliability of wellbore casing. This paper assesses the operational reliability of wellbore casing using...
journal article 2020
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Zhang, Y. (author), Wang, Xuancang (author), Ji, Guanyu (author), Fan, Zhenyang (author), Guo, Yuchen (author), Gao, Wenze (author), Xin, Lei (author)
Lignin, as a bio-based waste, has been utilized in the asphalt industry due to various advantages. This study aimed to investigate the effects of two lignin products (lignin powder and lignin fiber) on the mechanical properties of asphalt mixtures. The raveling, rutting, thermal and fatigue cracking resistance, and moisture susceptibility of...
journal article 2020
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Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)
The nanoindentation test was conducted in this paper to investigate the indentation hardness, plasticity and initial creep properties of pressure sintered nanosilver joint at various test temperatures. The effects of strain rate on the indentation hardness were first investigated. Then yield stress of nanosilver sintered joint was studied in...
journal article 2019
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Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Jiajie (author), Placette, Mark D. (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Modern power electronics has the increased demands in current density and high-temperature reliability. However, these performance factors are limited due to the die attach materials used to affix power dies microchips to electric circuitry. Although several die attach materials and methods exist, nanosilver sintering technology has received...
journal article 2019
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Liu, Y. (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, Kouchi (author), Sun, Fenglian (author)
Purpose: Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences and sintering pressures during the sintering processes. Design/methodology/approach: Three sintering sequences, S(a)...
journal article 2019
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Fan, J. (author), Wang, Zhen (author), Zhang, Xunwei (author), Deng, Zentao (author), Fan, Xuejun (author), Zhang, Kouchi (author)
In a high-power white light emitting diode (LED) package, the phosphor/silicone composite is typically used for photometric and colorimetric conversions, ultimately producing the white light. However, the phosphor/silicone composite is always exposed under harsh environments with high temperature, high blue light irradiation and high moisture...
journal article 2019
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Liu, Yang (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, Kouchi (author), Sun, Fenglian (author)
The microstructure, thickness, porosity, and shear performance of the silver (Ag) sintering layers under different sintering pressures were investigated. Experimental results demonstrated that the thickness and the porosity of the sintering layer decreased when the sintering pressure varied from 5 MPa to 30 MPa. This densification phenomenon...
journal article 2018
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Zhang, H. (author), Liu, Yang (author), Wang, Lingen (author), Fan, Jiajie (author), Fan, Xuejun (author), Sun, Fenglian (author), Zhang, Kouchi (author)
High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There...
journal article 2018
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