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Long, Xu (author), Chong, Kainan (author), Su, Yutai (author), Du, L. (author), Zhang, Kouchi (author)
The stress–strain response of sintered silver nanoparticles (AgNP) materials is precisely characterized in order to adapt for numerical analysis and rational design of electronic packaging structures in this study. A framework of crystal plasticity finite element method (CPFEM) is established based on the mechanism of crystal plastic...
journal article 2023
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Qian, Cheng (author), Gu, Tijian (author), Wang, Ping (author), Cai, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Sintered nano-silver die-attach materials have been widely used in high-power electronics packaging because of their high thermal and electrical conductivities. In this study, we characterized the tensile properties of sintered nano-silver particles over a range of strain rates and temperatures, and established the constitutive models. First, 50...
journal article 2022
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Li, Lijun (author), Wang, Rui (author), Zhao, Hui (author), Zhang, Haoran (author), Yan, R. (author)
This paper presents an experimental investigation on the dynamic mechanical performance of S30408 austenitic stainless steel (ASS) under elevated temperatures, which is essential for determining the behaviour of structures made with this type of steel subjected to the coupled fire and impact/explosion. For this purpose, the quasi-static and...
journal article 2021