Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

To fulfill the high-temperature application requirement of high-power electronics packaging, Cu nanoparticle sintering technology, with benefits in low-temperature processing and high-melting point, has attracted considerable attention as a promising candidate for the die-attach interconnect. Comprehensive mechanical characterization of the...

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...

Luminous performances characterization of YAG: Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations

YAG: Ce3+ phosphor/silicone composites are widely used in solid-state lighting as a light converter to achieve white lighting. However, because of high thermal resistance and low thermal stability, the luminous performance of YAG: Ce3+ phosphor/silicone composite deteriorates rapidly when excited by high-power-density blue-laser. To explore...

基于Lambert-Beer理论与人工神经网络的混合荧光粉发射光谱预测

The emission spectra of high color rendering phosphors, mixed with the yttrium aluminium garnet, silicon based oxynitride and nitride based phosphors, were predicted by the Lambert-Beer theory and back propagation neural network (BP NN). Firstly, the modified Lambert-Beer model was used to calculate the proportional coefficient of the...