Solder joint reliability risk estimation by AI-assisted simulation framework with genetic algorithm to optimize the initial parameters for AI models

Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation framework is developed to establish the risk estimation capability against the design and process...

Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model

Light-emitting diode (LED) arrays have attracted increased attention in the area of high power intelligent automotive headlamps because of their superiority in disposing of the power limit of an individual LED package and controllably luminous intensity and illumination pattern. The optical and chromatic performances of an LED array do not...