All-in-one improvement toward Li₆PS₅Br-Based solid electrolytes triggered by compositional tune

Sulfide solid electrolytes possess high ionic conductivity and moderate dendrite suppression capability, but rather poor compatibility against oxide cathodes and metallic Li. Here, we report O-doped Li₆PS₅Br as solid electrolyte synthesized by a facile solid-state sintering. Different from other O-incorporated sulfides,...

Influence of wheel polygonal wear on wheel-rail dynamic contact in a heavy-haul locomotive under traction conditions

For a heavy-haul locomotive within a wheel repairing period, wheel polygonal wear with different operating mileages is obtained by field testing. The test results show that the maximum radial runout of the wheel can increase to 0.87 mm and accompany with the typical damage of wheel tread shelling. Taking the wheel polygons as input excitation...

A numerical Bayesian-calibrated characterization method for multiscale prepreg preforming simulations with tension-shear coupling

Carbon fiber reinforced plastics (CFRPs) are attracting growing attention in industry because of their enhanced properties. Preforming of thermoset carbon fiber prepregs is one of the most common production techniques of CFRPs. To simulate preforming, several computational methods have been developed. Most of these methods, however, obtain...

Laboratory and numerical investigation of microwave heating properties of asphalt mixture

Microwave heating is an encouraging heating technology for the maintenance, recycling, and deicing of asphalt pavement. To investigate the microwave heating properties of asphalt mixture, laboratory tests and numerical simulations were done and compared. Two types of Stone Mastic Asphalt (SMA) mixture samples (with basalt aggregates and steel...

Characterization of PCB Embedded Package Materials for SiC MOSFETs

In this paper, a novel fan-out panel-level printed circuit board (PCB) embedded package technology for silicon carbide (SiC) MOSFET power module is presented to address parasitic inductances, heat dissipation, and reliability issues that are inherent with aluminum wires used in conventional packaging scheme. To withstand high temperature...

Review of Packaging Schemes for Power Module

SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance...