Hu, D. (author), Gu, Tijian (author), Cui, Z. (author), Vollebregt, S. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author) In high power electronics packaging, sintered silver nanoparticle joints suffer from thermal-humidity- electrical-chemical joint driven corrosion in extreme environments. In this paper, we conducted aging tests on sintered silver nanoparticles under high-temperature, high-humidity, and high-sulphur conditions. The results show that: (1) the...
journal article 2021
