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Wörhoff, Kerstin (author), Prak, Albert (author), Postma, F. (author), Leinse, A (author), Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Amaning-Appiah, B. (author), Renukappa, V. (author), Vollrath, G. (author), Balcells-Ventura, J. (author), Uhlig, P. (author), Seyfried, M. (author), Rose, D. (author), Santos, Raquel (author), Leijtens, XJM (author), Flintham, B. (author), Wale, M. (author), Robbins, D. (author)Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...conference paper 2016
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Boerkamp, M. (author), Van Leest, T. (author), Heldens, J. (author), Leinse, A. (author), Hoekman, M. (author), Heideman, R. (author), Caro, J. (author)We present a new approach to the dual-beam geometry for on-chip optical trapping and Raman spectroscopy, using waveguides microfabricated in TripleX technology. Such waveguides are box shaped and consist of SiO2 and Si3N4, so as to provide a low index contrast with respect to the SiO2 claddings and low loss, while retaining the advantages of...journal article 2014