Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...

Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures

With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the viability of Cu–Ag composite sintering material, focusing on solvent influence through...

Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...

Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H₂S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...