- document
-
Li, Ye (author), Mirza Gheytaghi, Amir (author), Trifunovic, M. (author), Xu, Yuanxing (author), Zhang, Kouchi (author), Ishihara, R. (author)3D integration has well-developed for traditional CMOS technology operating at room temperature, but few studies have been performed for cryogenic applications such as quantum computers. In this paper, a wafer-to-wafer bonding of superconductive joints based on niobium nitride (NbN) is performed to demonstrate the possibility of 3D...journal article 2021