Martin, H.A. (author), Reintjes, Marcia (author), Reijs, Dave (author), Dorrestein, Sander (author), Kengen, Martien (author), Libon, Sebastien (author), Smits, Edsger (author), Tang, Xiao (author), Koelink, Marco (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author) Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spreading applications. However, growing diamond films to the...
conference paper 2023
