Stress gradients in CrN coatings

Stress in hard films is the net sum of tensile stress generated at the grain boundaries, compressive stress due to ion peening, and thermal stress due to the difference in thermal expansion of the coating and substrate. The tensile part due to grain boundaries is thickness dependent. The other two contributions are not thickness dependent....

Defects and morphological changes in nanothin Cu films on polycrystalline Mo analyzed by thermal helium desorption spectrometry

Thermal helium desorption spectrometry (THDS) has been used for the investigation of defects and thermal stability of thin Cu films (5–200?Å) deposited on a polycrystalline Mo substrate in ultrahigh vacuum. These films are metastable at room temperature. On heating, the films transform into islands, giving rise to a relatively broad peak in the...

Stress in hard metal films

In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shrinkage and compressive stress is caused by ion peening. It is shown that the two contributions are additive. Moreover tensile stress generated at the grain boundaries does not relax by ion bombardment. In polycrystalline hard metal films the grain...