Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films

The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...

Contribution of extracellular polymeric substances fractions to the adsorption of silver nanoparticles by activated sludge

The extracellular polymeric substances (EPS) from activated sludge played significant roles in the removal of nanoparticles from wastewater. A series of batch experiments were carried out to determine the adsorption mechanism of three nano-Ag by activated sludge, as well as the contributions of EPS fractions including dissolved EPS (DEPS),...