Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Evaluation of the LDPM elastic and fracture parameters by up-scaling procedure

The heterogeneity of the concrete may be considered on different size scales of observation, ranging from the atomistic scale (10-10m), characterized by the behavior of crystalline particles of hydrated Portland cement, to the macroscopic scale (101 m), where concrete has traditionally been considered homogeneous. The multiscale framework we are...