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Inamdar, A.S. (author), Gromala, Przemyslaw Jakub (author), Prisacaru, Alexandru (author), Kabakchiev, Alexander (author), Yang, Yu Hsiang (author), Han, Bongtae (author)
Epoxy molding compound (EMC) is widely used for encapsulating automotive electronics. Among all of the components of an electronic package, EMC is most exposed to the atmosphere, and thus undergoes aging. During high-temperature operation, EMC is oxidized, which alters its mechanical properties, and thus can affect the reliability of electronic...
book chapter 2022
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Liu, Z. (author), Han, Xingjian (author), Zhang, Yuchen (author), Chen, Xiangjia (author), Lai, Y. (author), Doubrovski, E.L. (author), Whiting, Emily (author), Wang, C.C. (author)
In this paper, we present a new computational pipeline for designing and fabricating 4D garments as knitwear that considers comfort during body movement. This is achieved by careful control of elasticity distribution to reduce uncomfortable pressure and unwanted sliding caused by body motion. We exploit the ability to knit patterns in...
journal article 2021