Feasibility evaluation for development of composite propellers with embedded piezoelectric sensors

Marine propellers made of fibre-reinforced composites have demonstrated the potential to outperform metallic propellers in terms of efficiency and under-water noise radiation. For full realisation of this potential in a tailored design process with realistic constraints, accurate information on the hydrodynamic loads acting on composite...

Short-term Structural Performance of Self-monitoring Composite Marine Propellers

As a primary component of the marine propulsion systems, ship propellers have been traditionally made of nickel-aluminium-bronze (NAB) or manganese bronze (MB). With the development of fibre reinforced composite materials, the advanced plastic materials are considered to be applied in the manufacturing of marine propellers. Compared to...

Wheel-rail impact at an insulated rail joint in an embedded rail system

With dynamic behaviour different from that of traditional discretely supported tracks, continuously supported embedded rail systems (ERSs) have been increasingly used in railway bridges, level crossings, trams, and high-speed lines. However, studies on ERSs have been limited, and none of them have addressed the wheel-rail impact-induced dynamic...

Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network

A new panel-level silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) power module was developed by using the fan-out and embedded chip technologies. To achieve the more effective thermal management and higher reliability under thermal cycling, a new optimization method called Ant colony optimization-back...

Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum package parasitic inductance was found to be about 1.24 nH at 100...

A Computational Workflow for Flow and Transport in Fractured Porous Media Based on a Hierarchical Nonlinear Discrete Fracture Modeling Approach

Modeling flow and transport in fractured porous media has been a topic of intensive research for a number of energy- and environment-related industries. The presence of multiscale fractures makes it an extremely challenging task to resolve accurately and efficiently the flow dynamics at both the local and global scales. To tackle this challenge,...

Degree-biased random walk for large-scale network embedding

Network embedding aims at learning node representation by preserving the network topology. Previous embedding methods do not scale for large real-world networks which usually contain millions of nodes. They generally adopt a one-size-fits-all strategy to collect information, resulting in a large amount of redundancy. In this paper, we propose...

Characterization of PCB Embedded Package Materials for SiC MOSFETs

In this paper, a novel fan-out panel-level printed circuit board (PCB) embedded package technology for silicon carbide (SiC) MOSFET power module is presented to address parasitic inductances, heat dissipation, and reliability issues that are inherent with aluminum wires used in conventional packaging scheme. To withstand high temperature...