Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...

A novel GA-LSTM-based prediction method of ship energy usage based on the characteristics analysis of operational data

Optimization of ship energy efficiency is an efficient measure to decrease fuel usage and emissions in the shipping industry. The accurate prediction model of ship energy usage is the basis to achieve optimization of ship energy efficiency. This study investigates the sequential properties of the actual voyage data from a VLOC. On this basis,...