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Yuan, Cadmus (author), de Jong, S.D.M. (author), van Driel, W.D. (author)
The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this backdrop, machine learning technologies emerge as dynamic tools for correlation building and classification, revolutionizing the...
conference paper 2024