Searched for: subject%3A%22Thermal%255C+aging%22
(1 - 10 of 10)
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Inamdar, A.S. (author), van Soestbergen, M. (author), Mavinkurve, A. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Semiconductor devices are commonly encapsulated with Epoxy-based Moulding Compounds (EMC) to form an electronic package. EMC typically occupies a large volume within a package, and thus, governs its thermomechanical behaviour. When exposed to high temperatures (150°C and above), electronic packages predominantly show oxidation of the outer layer...
journal article 2024
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Inamdar, A.S. (author), van Soestbergen, Michiel (author), Mavinkurve, Amar (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical...
conference paper 2023
document
Bhardwaj, Ayan (author)
Medium voltage cable joints are expected to function for 30-40 years after successful installation. To optimize and improve the design of these joints, it is essential to find out the changes that the components inside a cable joint go through. In this thesis, the effects of accelerated thermal ageing on electrical and mechanical properties of...
master thesis 2022
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Inamdar, A.S. (author), Gromala, Przemyslaw Jakub (author), Prisacaru, Alexandru (author), Kabakchiev, Alexander (author), Yang, Yu Hsiang (author), Han, Bongtae (author)
Epoxy molding compound (EMC) is widely used for encapsulating automotive electronics. Among all of the components of an electronic package, EMC is most exposed to the atmosphere, and thus undergoes aging. During high-temperature operation, EMC is oxidized, which alters its mechanical properties, and thus can affect the reliability of electronic...
book chapter 2022
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Wang, H. (author), Liu, X. (author), Varveri, Aikaterini (author), Zhang, H. (author), Erkens, S. (author), Scarpas, Athanasios (author), Leng, Zhen (author)
Considering the application scenarios of rubber granules from waste tires in the bitumen modification process (wet or dry process), both aerobic and anaerobic aging of rubber may occur. The current study aims to investigate the thermal aging behavior of waste tire rubber samples using nanoindentation and environment scanning electron microscopy ...
journal article 2021
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Zhang, Z. (author), Zhang, S. (author), Yao, Z. (author), Tao, X. (author), Cao, X. (author), Zhang, P. (author), Kuang, P. (author), Fu, Y. (author), van Dijk, N.H. (author), van der Zwaag, S. (author)
The effect of thermal aging of homogenized Fe-Au and Fe-Au-W alloys, irradiated at room temperature with hydrogen ions, was studied for an aging treatment at 300 °C for aging times up to 100 h. The aging behavior of the Fe-based alloys is compared to the results for pure Fe. The precipitation behavior of Au-rich and W-rich precipitates and...
journal article 2021
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González, Sergio (author), Laera, Gianluca (author), Koussios, S. (author), Domínguez, Jaime (author), Lasagni, Fernando A. (author)
The simulation of long life behavior and environmental aging effects on composite materials are subjects of investigation for future aerospace applications (i.e. supersonic commercial aircrafts). Temperature variation in addition to matrix oxidation involves material degradation and loss of mechanical properties. Crack initiation and growth...
review 2018
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Yazdan Mehr, M. (author), Van Driel, W.D. (author), Zhang, G.Q. (author)
A methodology, based on accelerated degradation testing, is developed to predict the lifetime of remote phosphor plates used in solid-state lighting (SSL) applications. Both thermal stress and light intensity are used to accelerate degradation reaction in remote phosphor plates. A reliability model, based on the Eyring relationship, is also...
journal article 2015
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Yazdan Mehr, M. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
A methodology, based on accelerated degradation testing, is developed to predict the lifetime of remote phosphor plates used in solid-state lighting (SSL) applications. Both thermal stress and light intensity are used to accelerate degradation reaction in remote phosphor plates. A reliability model, based on the Eyring relationship, is also...
journal article 2015
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Sluimer, A.T. (author)
Electrical machines are used more often for many applications. This has caused the number of motors and generators to rise over the years. Reliability of these machines is an increasing demand, for industry relies heavily on the use of these machines. Maintenance is the best option to ensure reliability over the lifetime of these assets....
master thesis 2015
Searched for: subject%3A%22Thermal%255C+aging%22
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