Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin

Semiconductor devices are commonly encapsulated with Epoxy-based Moulding Compounds (EMC) to form an electronic package. EMC typically occupies a large volume within a package, and thus, governs its thermomechanical behaviour. When exposed to high temperatures (150°C and above), electronic packages predominantly show oxidation of the outer layer...

Warpage analysis on power module ceramic substrates

This study deals with the challenge of warpage in power modules, vital components in the rapidly expanding electric and hybrid-electric vehicle industry. The variations in temperature during manufacturing, resulting in significant warpage changes, contribute to device cracks, delamination, and reduced reliability.<br/>The primary focus is...

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical...

Computational analysis of warpage of composite laminates: Towards digital twins of laminates fabricated from an automation line

Airborne Composites Automation recently installed an automation product line that creates flat thermoplastic laminates intended for consumer electronics industry. However, due to the composite nature of the material and the process parameters, the final product is deformed, as a result of internal residual stresses. The purpose of this thesis is...