6G Beamforming Antenna-in-Package: Improving Efficiency using Direct Impedance Matching

As the world is getting used to 5G technology, 6G is already on the horizon. With the ultimate goal of very low latency communication and Tbps data rates, 6G supports new wireless technologies such as virtual and augmented reality and autonomous driving. In this new generation of wireless communication, high frequencies up to 100 GHz are used...

Design of the AiP feeding lines for 6G applications in a high definition fan-out technology

Since 2018, a race on 6G technology between many countries and institutions has started.<br/>As 6G mobile communication utilizes sub-THz frequency band, the antenna packaging requires higher level integration. Antenna in Package (AiP) is seen as a promising solution when it comes to the integration problem. At 100GHz operation frequency band,...

Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection...

H-band Quartz-Silicon Leaky-Wave Lens with Air-Bridge Interconnect to GaAs Front-End

Thanks to the large bandwidth availability, millimeter and sub-millimeter wave systems are getting more attractive to be used in a wide range of applications, such as high-resolution radar or high-speed communications. In this contribution, a new lens antenna in-package solution is presented for the H-band (220320 GHz), including a wideband...

Through Package Via: A bottom-up approach

The rapid development of semiconductor industry in the past decades has reshaped the world tremendously and greatly changed people's lives. Two-dimensional (2D) down-sizing of semiconductor devices following the “Moore's law” for many years is now reaching its boundary conditions of further exponential growth and three-dimensional (3D)...