- document
-
Neeft, Tobias (author)Silicon wafers and solar cells are delicate components used in the semiconductor industries and energy industries. Handling and transportation can easily damage these components. Conventional handling methods with mechanical contact can cause various damages to these delicate surfaces. Air bearings can provide a solution by enabling an almost...master thesis 2023
- document
-
Phongprueksathat, N. (author)Since the industrial revolution in the 1760s, the CO2 concentration in the atmosphere has been rising incessantly driving global warming closer to the point of no return. The world requires urgent actions to not only reduce CO2 emissions but also capture the CO2 for utilization to mitigate the future environmental crisis. CO2 hydrogenation to...doctoral thesis 2023
- document
-
Brudzisz, Anna (author), Giziński, Damian (author), Liszewska, Malwina (author), Wierzbicka, Ewa (author), Tiringer, U. (author), Taha, Safeya A. (author), Zając, Marcin (author), Orzechowska, Sylwia (author), Jankiewicz, Bartłomiej (author), Taheri, P. (author), Stępniowski, Wojciech J. (author)The low-voltage (< 5 V) anodization of copper in aqueous solutions of sodium bicarbonate was studied for the first time. As demonstrated, this method leads to the formation of microstructures on a copper surface, that are composed of malachite (CuCO<sub>3</sub>·Cu(OH)<sub>2</sub>). Moreover, by tuning the operating conditions, i.e.,...journal article 2023
- document
-
Santos, Janaina S. (author), Márquez, Victor (author), Buijnsters, J.G. (author), Praserthdam, Supareak (author), Praserthdam, Piyasan (author)This study presents environmentally friendly and low-cost synthetic routes to produce antimicrobial coatings over 5052 Al alloy based on plasma electrolytic oxidation (PEO) technology. Two methodologies were explored: the decoration with copper and anodic doping with copper ions. The porous oxide layers produced in silicate media presented...journal article 2023
- document
-
Abdinejad, M. (author), Subramanian, S.S. (author), Motlagh, Mozhgan Khorasani (author), Ripepi, D. (author), Pinto, D. (author), Li, Mengran (author), Middelkoop, J. (author), Urakawa, A. (author), Burdyny, T.E. (author)The electrochemical CO<sub>2</sub> reduction reaction (CO<sub>2</sub>RR) is an attractive method to produce renewable fuel and chemical feedstock using clean energy sources. Formate production represents one of the most economical target products from CO<sub>2</sub>RR but is primarily produced using post-transition metal catalysts that...journal article 2023
- document
-
Chen, Wei (author), Jiang, Jing (author), Meda, Abdulmelik H. (author), Ibrahim, Mesfin S. (author), Zhang, Kouchi (author), Fan, J. (author)SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...journal article 2023
- document
-
Shah, Mustafeez Bashir (author)Many semiconductor sensors, particularly MEMS sensors such as inertial, temperature, pressure, and resonance sensors need a vacuum environment for optimal performance and sensitivity in addition to the improvement in their long-term reliability. With the rise of heterogeneous integration with the MEMS and ICs being integrated together, process...master thesis 2022
- document
-
jiao, weiping (author)This thesis investigates the all-copper fine pitch bonding process with photoimageable underfill. NanoCU paste is used as interconnect material. A bi-layer photo resist structure is manufactured and lithographic stencil printing is used to apply nanoCu paste. A new underfill injection method is realized by using epoxy resin based photo resist as...master thesis 2022
- document
-
Ruig, Nina (author)The implications of a CE and the transition towards it are widely researched. However, there is a lack of research into the relevant geographical scales of CE. Thus, this research aims to present a framework that identifies the optimal geographical scale for the recycling of materials based on various factors. The framework is tested against a...master thesis 2022
- document
-
Whittle Rodriguez, Luis (author)The widespread concerns about climate change, as well as the major enabling factors for the transition that are required to guarantee its control, necessitate research and a tool that can provide insight into the future of copper mining.The world's copper supply is primarily concentrated in a few producing locations: Chile, Peru, Democratic...master thesis 2022
- document
-
Han, C. (author)In the efficiency-driven photovoltaic (PV) industry, the market dominating crystalline silicon (c-Si) technology has been developing towards PV devices with carrier-selective passivating contacts (CSPCs). Especially, the silicon heterojunction (SHJ) solar cell, based on hydrogenated amorphous silicon (a-Si:H) contact stacks, and the poly-Si...doctoral thesis 2022
- document
-
Ariëns, M.I. (author), van de Water, L. G.A. (author), Dugulan, A.I. (author), Brück, E.H. (author), Hensen, E. J.M. (author)Copper promotion of chromium-doped iron oxide prepared via co-precipitation for high-temperature water–gas shift (WGS) catalysis is investigated. Low-temperature Mössbauer spectra demonstrate that copper doping delays hematite (α-Fe<sub>2</sub>O<sub>3</sub>) formation in the fresh catalyst, favoring the formation of small crystallites of...journal article 2022
- document
-
Fan, Jiajie (author), Jiang, Dawei (author), Zhang, Hao (author), Hu, D. (author), Liu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author)Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...journal article 2022
- document
-
Burdyny, T.E. (author), Sassenburg, M. (author), de Rooij, R. (author), Nessbit, Nathan (author), Kas, R. (author), Chandrashekar, S. (author), Firet, N.J. (author), Yang, K. (author), Liu, K. (author), Blommaert, M.A. (author), Kolen, M. (author), Ripepi, D. (author), Smith, W.A. (author)Continued advancements in the electrochemical reduction of CO 2 (CO 2RR) have emphasized that reactivity,selectivity, and stability are not explicit material properties butcombined effects of the catalyst, double-layer, reaction environ-<br/>ment, and system configuration. These realizations have steadily built upon the foundational work...journal article 2022
- document
-
Asperti, S. (author), Hendrikx, R.W.A. (author), Gonzalez Garcia, Y. (author), Kortlever, R. (author)Copper is one of the most promising catalysts for the CO<sub>2</sub> reduction reaction (CO<sub>2</sub>RR) due to its unique capability of producing multicarbon products in appreciable quantities. Most of the CO<sub>2</sub>RR research efforts have been directed towards the development of new electrocatalysts to either increase product...journal article 2022
- document
-
Liu, Gang (author), Du, Zhao (author), Xiao, Tian (author), Guo, Junfei (author), Lu, Liu (author), Yang, Xiaohu (author), Hooman, K. (author)Solar energy, as a kind of renewable energy, offers a large reserve to be harvested at a reasonably low cost for engineering applications. To decouple the temporal and spatial relevance of the continuous energy supply of solar energy, latent heat thermal energy storage can deal with this problem at different temperatures. Aiming to improve...journal article 2022
- document
-
Chen, N. (author), Rudolph, Dominik (author), Peter, Christoph (author), Zeman, M. (author), Isabella, O. (author), Rosen, Yitzchak (author), Grouchko, Michael (author), Shochet, Ofer (author), Mihailetchi, Valentin D. (author)The high usage of silver in industrial solar cells may limit the growth of the solar industry. One solution is to replace Ag with copper. A screen printable Cu paste is used herein to metallize industrial interdigitated back contact (IBC) solar cells. A novel metallization structure is proposed for making solar cells. Cu paste is applied to...journal article 2022
- document
-
Lv, Guoping (author), Yan, Haidong (author), Yan, Haidong (author), Yang, Daoguo (author), Wu, Xinke (author), Sheng, Kuang (author), Liu, Chaohui (author), Zhang, Yakun (author), Zhang, Kouchi (author)As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging...conference paper 2022
- document
-
Poudel, Prakash (author), Sharma, S. (author), Ansari, Mohamed Nainar Mohamed (author), Kumar, Pushpendra (author), Ibrahim, Sobhy M. (author), Vaish, Rahul (author), Kumar, Rajeev (author), Thomas, Paramanandam (author)In this study, a method for the bacterial disinfection of drinking water in the water storage systems based on the electric potential generated from a piezoelectric wind energy harvester is presented. First, an efficient galloping piezoelectric wind energy harvester is designed by adding curve- shaped attachments to the bluff body of the...journal article 2022
- document
-
Ji, X. (author), van Zeijl, H.W. (author), Romijn, J. (author), van Ginkel, H.J. (author), Liu, X. (author), Zhang, Kouchi (author)The continuous trend to integrate more multi-functions in a package often involves, Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The conventional flip chip for die-on-substrate technology applies solder for integration. However, solder joint integration has the disadvantages of restricting height, reflow...conference paper 2022