Searched for: subject%3A%22interfacial%255C+fracture%255C+toughness%22
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Sadeghinia, M. (author)
Thin layers of dissimilar materials are used in most microelectronic components in order to achieve special functional requirements. Generally, the interface between two adjacent materials forms a weak link, not only because of the relatively low delamination strength, but also because of the existing mismatch in thermo-mechanical properties,...
doctoral thesis 2013
Schlottig, G. (author)
This book describes a setup that allows to delaminate the Silicon-to-Molding Compound interface for obtaining interfacial fracture parameters: the Mixed Mode Chisel setup (MMC). With this device for the first time the delamination can be initiated and propagated, while preventing the occurrence of random brittle fracture in one or both of the...
doctoral thesis 2012