Power and Thermal Cycling Testbed for End of Life Assessment of Semiconductor Devices

The reliability of semiconductor power devices can be studied by performing a thermal and power cycling test. In order to create the desired temperature cycles, there are four free variables to select during the power cycling test, namely the heating current, heating time, cooling time, and heatsink temperature. In this paper, the relation...

Single-electron thermal devices coupled to a mesoscopic gate

We theoretically investigate the propagation of heat currents in a three-terminal quantum dot engine. Electron-electron interactions introduce state-dependent processes which can be resolved by energy-dependent tunneling rates. We identify the relevant transitions which define the operation of the system as a thermal transistor or a thermal...